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Resources

White Paper - Comparing Multi-Patterning at 5nm: SADP, SAQP, and SALELE
Self-aligned multi-patterning techniques such as SADP, SAQP, and SALELE are increasingly popular at advanced nodes, but each process has its pros and cons. IMEC and Mentor, a Siemens business collaborated to identify potentially less-obvious process and design limitations and trade-offs between the three SAMP techniques. Learn more in this paper. Download Now
White Paper - Faster P2P Resistance Debugging of Supply Nets
Want to minimize resource and load times, while improving P2P resistance debugging? In this paper we demonstrate how filtering the supply net to show only the section relevant to the P2P results minimizes resource usage and loading time, while improving P2P resistance debugging efficiency. Download Now
White Paper - Getting Started with Critical Area Analysis
Critical area analysis (CAA) can be used by both designers and foundries to directly improve the manufacturability, and ultimately the profitability, of IC designs. In this white paper we introduce the concept of defect density data for critical area analysis and how it can impact yield. Download Now

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